Applied Physics A (2024) 130:541

https://doi.org/10.1007/s00339-024-07660-y

1. In this article, there was an inadvertent mix-up in the figure captions. The captions were shuffled during the final proof generation.

The figures with correct caption are below:

The caption for Fig. 1 is:

Figure 1 Schematic demonstration for the fabrication of electrode through electrodeposition process

The caption for Fig. 2 is:

Figure 2 (a) XRD spectra of synthesized MnS, CoS and CuS, (b) Reitveld refinement of MnS, CoS, and CuS, SEM images of (c) MnS, (d) CoS, and (e) CuS

The caption for Fig. 3 is:

Figure 3 (a) Cyclic voltammetry of MnS electrode in three-electrode assembly, (b) Peak voltage as a function of the natural log of scan rates, (c) Peak current vs. scan rate, (d) Log of peak current versus the natural log of scan rate, and (e) Bar plot representing the total specific capacitance contribution in capacitive and diffusive parameter

The caption for Fig. 4 is:

Figure 4 (a) CV profile for CoS electrode, (b) Peak voltage plotted against log of scan rate, (c) Peak current as a function of scan rate, (d) Natural log of peak current versus the natural log of scan rate, and (e) Bar plot representing the total specific capacitance contribution in capacitive and diffusive parameter

The caption for Fig. 5 is:

Figure 5 (a) CV analysis of CuS electrode (b) Peak voltage plotted against log of scan rate (c) Peak current as a function of scan rate, (d) Log of peak current as a function of the log of scan rate, and (e) Bar plot representing the total specific capacitance contribution in capacitive and diffusive parameter

The caption for Fig. 6 is:

Figure 6 Galvanostatic charge-discharge characteristics of (a) MnS, (b) CoS, and (c) CuS

The caption for Fig. 7 is:

Figure 7 Electrochemical impedance spectroscopy with an inset zoom image of the high-frequency region of (b) MnS, (c) CoS, and (d) CuS along with the fitted curve with the circuit model used for fitting

The caption for Fig. 8 is:

Figure 8 Columbic efficiency of (b) MnS, (c) CoS, and (d) CuS

2. Typo in Sect. 2.2 is corrected as follows (“HCL” to “HCl”):.

Electrodeposition for electrode formation

The substrate (nickel foam) for material deposition is washed with HCl, acetone, and DI water to eliminate the impurities.

3. Typo in Eq. 2and Eq. 6are corrected as follows:

The corrected version of the Eq. 2is:

$${\rm{MnS }} + {\rm{ O}}{{\rm{H}}^ - } \leftrightarrow {\rm{ MnSOH }} + {\rm{ }}{{\rm{e}}^ - }$$
(2)

The corrected version of the Eq. 6is:

$$\:i\left(v\right)=kv+{k}_{2}{v}^{1/2}$$
(6)

4. Corrected Fig. 2along with the updated caption as follows:

Fig. 2
figure 1

(a) XRD spectra of synthesized MnS, CoS and CuS, (b) Reitveld refinement of MnS, CoS, and CuS, SEM images of (c) MnS, (d) CoS, and (e) CuS

5. The corrected text of Fig. 2should be included in the main text of the manuscript as follows:

3.1 Structural and morphological studies

The XRD analysis in Fig. 2(a) confirmed the phase formation of all three sulfides based on different transition metals. The crystallite size measured through the given XRD patterns of the sample can be obtained through the Sherrer formula given below:

$${\rm{D}} = {{K\lambda } \over {\beta \cos \theta }}$$
(1)

Where D is the crystallite size (nm), K is the Scherrer constant (0.9), λ is the wavelength of the X-ray source (0.15406 nm), β is the FWHM (radians), and θ is the peak position (radians). Associated lattice parameters and crystallite size are shown in Table 1. Furthermore, the Rietveld refinement of the XRD pattern of the respective samples is shown in Fig. 2(b). The XRD of the samples was collected using monochromatic Cu-Kα radiation. The observed and calculated patterns are shown, along with the difference pattern and the peak position markers. Further the SEM micrographs of MnS, CoS, and CuS are depicted in Fig. 2 (c-e). For the analysis and comparison of all three samples, the micrographs were taken at the same magnification. As the electrodes were fabricated via electrodeposition, therefore the SEM images demonstrate the uniform binder-free deposition of desired material onto the Ni form substrates. These binder-free depositions are essential to significantly improve the conductivity of the electrodes and thereby boosting the electrochemical performance of energy storage devices.

6. The corrected version of graphical abstract is as follows:

figure 2

The original article has been corrected.